Iindima ezithile zobukrelekrele bokwenziwa ekucoceni izinto

Iindaba

Iindima ezithile zobukrelekrele bokwenziwa ekucoceni izinto

I. Ukuhlolwa kwezinto eziluhlaza kunye nokuphuculwa kwangaphambi konyango

  1. Umgangatho we-Ore ochanekileyo kakhuluIinkqubo zokuqaphela imifanekiso ezisekelwe ekufundeni nzulu zihlalutya iimpawu zomzimba zeentsimbi (umz., ubungakanani bamasuntswana, umbala, ubunjani) ngexesha langempela, zifezekisa ukuncipha kweempazamo ezingaphezu kwama-80% xa kuthelekiswa nokuhlela ngesandla.
  2. Uvavanyo lwezixhobo olusebenza kakuhle kakhuluI-AI isebenzisa ii-algorithms zokufunda koomatshini ukuchonga ngokukhawuleza abaviwa abacocekileyo kakhulu abavela kwizigidi zeendibaniselwano zezinto. Umzekelo, ekuphuhlisweni kwe-electrolyte yebhetri ye-lithium-ion, ukusebenza kakuhle kovavanyo kunyuka ngobukhulu xa kuthelekiswa neendlela zemveli.

II. Uhlengahlengiso olunamandla lweeParamitha zeNkqubo

  1. Ukulungiswa kweParamitha yeSihluthuleloKwi-semiconductor wafer chemical vapor deposition (CVD), iimodeli ze-AI zijonga iiparameter ezifana nobushushu kunye nokuhamba kwegesi ngexesha langempela, zilungisa ngokuguquguqukayo iimeko zenkqubo ukunciphisa iintsalela zokungcola ngama-22% kunye nokuphucula isivuno nge-18%.
  2. Ulawulo lweNtsebenziswano lweeNkqubo ezininziIinkqubo zempendulo ezivaliweyo zidibanisa idatha yovavanyo kunye noqikelelo lwe-AI ukuze kuphuculwe iindlela zokwenziwa kunye neemeko zokusabela, kunciphisa ukusetyenziswa kwamandla okucocwa ngaphezulu kwe-30%.

III. Ukuchonga ubuNgcola obukrelekrele kunye noLawulo loMgangatho

  1. Ukuchongwa Okugqibeleleyo Kweziphene ZeMicroscopicUmbono wekhompyutha kunye nemifanekiso enesisombululo esiphezulu ibona imifantu ye-nanoscale okanye ukusasazwa kokungcola ngaphakathi kwezinto, ifezekisa ukuchaneka kwe-99.5% kwaye ithintele ukuwohloka kokusebenza emva kokuhlanjululwa 8 .
  2. Uhlalutyo lweDatha yeSpectralIi-algorithms ze-AI zitolika ngokuzenzekelayo idatha ye-X-ray diffraction (XRD) okanye i-Raman spectroscopy ukuze zichonge ngokukhawuleza iintlobo zokungcola kunye noxinzelelo, zikhokela amaqhinga okucocwa okujoliswe kuwo.

IV. UkuZenzekela kweNkqubo kunye nokuPhucula ukusebenza kakuhle

  1. Uvavanyo oluNcedwa yiRobhothiIinkqubo zerobhothi ezikrelekrele zenza imisebenzi ephindaphindwayo ngokuzenzekelayo (umz., ukulungiselela isisombululo, ukujikelezisa i-centrifugation), ukunciphisa ukungenelela ngesandla ngama-60% kunye nokunciphisa iimpazamo zokusebenza.
  2. Uvavanyo lweHigh-ThroughputIiplatifomu ezizenzekelayo eziqhutywa yi-AI ziqhuba amakhulu eemvavanyo zokucoca ngaxeshanye, zikhawulezisa ukuchongwa kweendibaniselwano zenkqubo ezifanelekileyo kwaye zinciphisa imijikelo ye-R&D ukusuka kwiinyanga ukuya kwiiveki.

V. Ukwenza Izigqibo Eziqhutywa Yidatha kunye Nokuphucula Izinga Elininzi

  1. Ukuhlanganiswa kwedatha yemithombo emininziNgokudibanisa ukwakheka kwezinto, iiparameter zenkqubo, kunye nedatha yokusebenza, i-AI yakha iimodeli zokuqikelela iziphumo zokucoca, inyusa amazinga empumelelo ye-R&D ngaphezulu kwe-40%.
  2. Ukulinganisa Ulwakhiwo Lwenqanaba LeathomI-AI idibanisa izibalo ze-density functional theory (DFT) ukuqikelela iindlela zokufuduka kwe-athomu ngexesha lokucocwa, ikhokela amaqhinga okulungisa iziphene ze-lattice.

Uthelekiso lweSifundo seTyala

Imeko

Imida Yeendlela Zemveli

Isisombululo se-AI

Uphuculo Lokusebenza

Ukucocwa kwesinyithi

Ukuxhomekeka kuvavanyo lobunyulu ngesandla

Ukubeka esweni ukungcola ngexesha langempela yiSpectral + AI

Izinga lokuthobela ucoceko: 82% → 98%

Ukucocwa kweSemiconductor

Uhlengahlengiso lweparameter olulibazisekileyo

Inkqubo yokwenza ngcono iiparameter ezinamandla

Ixesha lokucubungula ibhetshi lincitshiswe ngama-25%

Ukwenziwa kwezinto zeNanomaterial

Ukusasazwa kobungakanani bamasuntswana okungahambelaniyo

Iimeko zokwenziwa kwe-ML ezilawulwa yi-ML

Ukufana kwamasuntswana kuphuculwe ngama-50%

Ngale ndlela, i-AI ayipheleli nje ekubumbeni indlela yophando nophuhliso yokucocwa kwezinto kodwa ikwaqhubela phambili ishishini kwindlelauphuhliso olukrelekrele noluzinzileyo

 

 


Ixesha leposi: Matshi-28-2025