I. Ukuhlolwa kwezinto eziluhlaza kunye nokuphuculwa kwangaphambi konyango
- Umgangatho we-Ore ochanekileyo kakhuluIinkqubo zokuqaphela imifanekiso ezisekelwe ekufundeni nzulu zihlalutya iimpawu zomzimba zeentsimbi (umz., ubungakanani bamasuntswana, umbala, ubunjani) ngexesha langempela, zifezekisa ukuncipha kweempazamo ezingaphezu kwama-80% xa kuthelekiswa nokuhlela ngesandla.
- Uvavanyo lwezixhobo olusebenza kakuhle kakhuluI-AI isebenzisa ii-algorithms zokufunda koomatshini ukuchonga ngokukhawuleza abaviwa abacocekileyo kakhulu abavela kwizigidi zeendibaniselwano zezinto. Umzekelo, ekuphuhlisweni kwe-electrolyte yebhetri ye-lithium-ion, ukusebenza kakuhle kovavanyo kunyuka ngobukhulu xa kuthelekiswa neendlela zemveli.
II. Uhlengahlengiso olunamandla lweeParamitha zeNkqubo
- Ukulungiswa kweParamitha yeSihluthuleloKwi-semiconductor wafer chemical vapor deposition (CVD), iimodeli ze-AI zijonga iiparameter ezifana nobushushu kunye nokuhamba kwegesi ngexesha langempela, zilungisa ngokuguquguqukayo iimeko zenkqubo ukunciphisa iintsalela zokungcola ngama-22% kunye nokuphucula isivuno nge-18%.
- Ulawulo lweNtsebenziswano lweeNkqubo ezininziIinkqubo zempendulo ezivaliweyo zidibanisa idatha yovavanyo kunye noqikelelo lwe-AI ukuze kuphuculwe iindlela zokwenziwa kunye neemeko zokusabela, kunciphisa ukusetyenziswa kwamandla okucocwa ngaphezulu kwe-30%.
III. Ukuchonga ubuNgcola obukrelekrele kunye noLawulo loMgangatho
- Ukuchongwa Okugqibeleleyo Kweziphene ZeMicroscopicUmbono wekhompyutha kunye nemifanekiso enesisombululo esiphezulu ibona imifantu ye-nanoscale okanye ukusasazwa kokungcola ngaphakathi kwezinto, ifezekisa ukuchaneka kwe-99.5% kwaye ithintele ukuwohloka kokusebenza emva kokuhlanjululwa 8 .
- Uhlalutyo lweDatha yeSpectralIi-algorithms ze-AI zitolika ngokuzenzekelayo idatha ye-X-ray diffraction (XRD) okanye i-Raman spectroscopy ukuze zichonge ngokukhawuleza iintlobo zokungcola kunye noxinzelelo, zikhokela amaqhinga okucocwa okujoliswe kuwo.
IV. UkuZenzekela kweNkqubo kunye nokuPhucula ukusebenza kakuhle
- Uvavanyo oluNcedwa yiRobhothiIinkqubo zerobhothi ezikrelekrele zenza imisebenzi ephindaphindwayo ngokuzenzekelayo (umz., ukulungiselela isisombululo, ukujikelezisa i-centrifugation), ukunciphisa ukungenelela ngesandla ngama-60% kunye nokunciphisa iimpazamo zokusebenza.
- Uvavanyo lweHigh-ThroughputIiplatifomu ezizenzekelayo eziqhutywa yi-AI ziqhuba amakhulu eemvavanyo zokucoca ngaxeshanye, zikhawulezisa ukuchongwa kweendibaniselwano zenkqubo ezifanelekileyo kwaye zinciphisa imijikelo ye-R&D ukusuka kwiinyanga ukuya kwiiveki.
V. Ukwenza Izigqibo Eziqhutywa Yidatha kunye Nokuphucula Izinga Elininzi
- Ukuhlanganiswa kwedatha yemithombo emininziNgokudibanisa ukwakheka kwezinto, iiparameter zenkqubo, kunye nedatha yokusebenza, i-AI yakha iimodeli zokuqikelela iziphumo zokucoca, inyusa amazinga empumelelo ye-R&D ngaphezulu kwe-40%.
- Ukulinganisa Ulwakhiwo Lwenqanaba LeathomI-AI idibanisa izibalo ze-density functional theory (DFT) ukuqikelela iindlela zokufuduka kwe-athomu ngexesha lokucocwa, ikhokela amaqhinga okulungisa iziphene ze-lattice.
Uthelekiso lweSifundo seTyala
| Imeko | Imida Yeendlela Zemveli | Isisombululo se-AI | Uphuculo Lokusebenza |
| Ukucocwa kwesinyithi | Ukuxhomekeka kuvavanyo lobunyulu ngesandla | Ukubeka esweni ukungcola ngexesha langempela yiSpectral + AI | Izinga lokuthobela ucoceko: 82% → 98% |
| Ukucocwa kweSemiconductor | Uhlengahlengiso lweparameter olulibazisekileyo | Inkqubo yokwenza ngcono iiparameter ezinamandla | Ixesha lokucubungula ibhetshi lincitshiswe ngama-25% |
| Ukwenziwa kwezinto zeNanomaterial | Ukusasazwa kobungakanani bamasuntswana okungahambelaniyo | Iimeko zokwenziwa kwe-ML ezilawulwa yi-ML | Ukufana kwamasuntswana kuphuculwe ngama-50% |
Ngale ndlela, i-AI ayipheleli nje ekubumbeni indlela yophando nophuhliso yokucocwa kwezinto kodwa ikwaqhubela phambili ishishini kwindlelauphuhliso olukrelekrele noluzinzileyo
Ixesha leposi: Matshi-28-2025
